BS - Britské národní normy

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Thermal conductivity test for base materials.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for Z-axis expansion of base materials and printed boards.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for time to delamination. T260, T288, T300.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. X/Y CTE test for thin base materials by TMA.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Decomposition temperature (T_d) using TGA.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies. Thermal resistance of an assembly by thermal transient method.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies. X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures.

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Detection of plating defects in unpopulated circuit boards by computed tomography (CT).

Dostupné jazyky: Anglicky

Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené