Potřebujeme Váš souhlas k využití jednotlivých dat, aby se Vám mimo jiné mohli ukazovat informace týkající se Vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Stránka 3814
Circuit boards and circuit board assemblies. Design and use. Land pattern design. Description of land pattern for the most common surface mounted components (SMD).
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Circuit boards and circuit board assemblies. Design and use. Land pattern design. Description of land pattern for through hole components (THT).
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Printed boards and printed board assemblies. Design and use. Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Printed boards and printed board assemblies. Design and use. Electronic component zero orientation for CAD library construction.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Measurement of melting temperature or melting temperature ranges of solder alloys.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, printed board and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures. Relative permittivity and loss tangent (500 MHz to 10 GHz).
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies. Detection of defects in interconnection structures by measurement of capacitance.
Dostupné jazyky: Anglicky
Dostupné prevedenie: PDF - okamžité stiahnutie, Tlačené