UNE - Španělské národní normy

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (Endorsed by AENOR in July of 2008.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (Endorsed by Asociación Espanola de Normalización in May of 2021.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (Endorsed by Asociación Espanola de Normalización in April of 2021.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (Endorsed by Asociación Espanola de Normalización in March of 2025.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (Endorsed by Asociación Espanola de Normalización in August of 2019.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (Endorsed by Asociación Espanola de Normalización in August of 2017.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES. PART 1: GENERAL TEST METHODS AND METHODOLOGY (Endorsed by AENOR in November of 1997.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Test methods for electrical materials, interconnection structures and assemblies -- Part 1: General test methods and methodology. (Endorsed by AENOR in March of 2002.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (Endorsed by AENOR in August of 2013.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials (Endorsed by Asociación Espanola de Normalización in April of 2022.)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Elektronické PDF, Tlačené