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Page 3496
Basic dimensions of winding wires. Specification for maximum overall diameters of enamelled round winding wires.
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Guidance for the selection of high-voltage A.C. cable systems.
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High-pressure mercury vapour lamps. Performance specifications.
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Recommendations for performance standards in building. Contents and presentation.
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices.
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Mechanical standardization of semiconductor devices. Dimensions.
Available languages: English
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits.
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Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages.
Available languages: English
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals.
Available languages: English
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Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Dimensions of P-VSON.
Available languages: English
Available design: PDF - Immediate download, Print design