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BS - British national standards
Page 3497
BS EN 60191-6-12:2011 (31/08/2011)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA).
Available languages: English
Available design: PDF - Immediate download, Print design
from 266.80 EUR more info
BS EN 60191-6-13:2016 (31/12/2016)
Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA).
Available languages: English
Available design: PDF - Immediate download, Print design
from 266.80 EUR more info
BS EN 60191-6-16:2007 (31/07/2007)
Mechanical standardization of semiconductor devices. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA.
Available languages: English
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from 163.30 EUR more info
BS EN 60191-6-17:2011 (30/06/2011)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA).
Available languages: English
Available design: PDF - Immediate download, Print design
from 266.80 EUR more info
BS EN 60191-6-18:2010 (31/10/2010)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA).
Available languages: English
Available design: PDF - Immediate download, Print design
from 266.80 EUR more info
BS EN 60191-6-19:2010 (30/06/2010)
Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage.
Available languages: English
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from 190.90 EUR more info
BS EN 60191-6-2:2002 (04/03/2003)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages.
Available languages: English
Available design: PDF - Immediate download, Print design
from 163.30 EUR more info
BS EN 60191-6-20:2010 (31/12/2010)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ).
Available languages: English
Available design: PDF - Immediate download, Print design
from 190.90 EUR more info
BS EN 60191-6-21:2010 (31/12/2010)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP).
Available languages: English
Available design: PDF - Immediate download, Print design
from 190.90 EUR more info
BS EN 60191-6-22:2013 (30/04/2013)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA).
Available languages: English
Available design: PDF - Immediate download, Print design
from 190.90 EUR more info
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