GB - Chinese national standards

Electronic components—Long-term storage of electronic semiconductor devices—Part 4: Storage

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Electronic components—Long-term storage of electronic semiconductor devices—Part 5Die and wafer devices

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Electronic components—Long-term storage of electronic semiconductor devices—Part 6: Package or finished devices

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Electronic components—Long-term storage of electronic semiconductor devices—Part 7Micro-electromechanical devices

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Electronic components—Long-term storage of electronic semiconductor devices—Part 8Passive electronic devices

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Electronic components—Long-term storage of electronic semiconductor devices—Part 9Special cases

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Remote operation and maintenance of computer numerical control (CNC) machine tools—Part 1: General requirements

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Remote operation and maintenance of computer numerical controlCNC machine tools—Part 2: Fault diagnose and predictive maintenance

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Guideline for financial cybersecurity threat information sharing

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Semiconductor devices—Micro-electromechanical devices—Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

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