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Semiconductor devices—Micro-electromechanical devices—Part 19: Electronic compasses

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Available design: electronic design (pdf), Print design

Semiconductor devices—Micro-electromechanical devices—Part 2: Tensile testing method of thin film materials

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Available design: electronic design (pdf), Print design

Semiconductor devices—Micro-electromechanical devices—Part 21: Test method for Poisson""s ratio of thin film MEMS materials

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Available design: electronic design (pdf), Print design

Semiconductor devices—Micro-electromechanical devices—Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

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Available design: electronic design (pdf), Print design

Semiconductor devices—Micro-electromechanical devices—Part 29: Electromechanical relaxation test method for freestanding conductive thin films under room temperature

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Semiconductor devices—Micro-electromechanical devices—Part 3: Thin film standard test piece for tensile testing

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Semiconductor devices—Micro-electromechanical devices—Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices

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Semiconductor devices—Micro-electromechanical devices—Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films

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Semiconductor devices—Micro-electromechanical devices—Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection

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Available design: electronic design (pdf), Print design

Semiconductor devices—Micro-electromechanical devices—Part 40: Test methods of MEMS inertial shock switch threshold

Available languages: English, Chinese

Available design: electronic design (pdf), Print design