ČSN - Czech national standards

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)

Available languages: English

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Available languages: English (the title page in Czech only)

Available design: Print design

Mechanical standardization of semiconducor devices - Part 2: Dimensions - Eighteenth supplement

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconducor devices - Part 2: Dimensions - Nineteenth supplement

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconducor devices - Part 2: Dimensions - Twentieth supplement

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-second supplement

Available languages: Czech preface only

Available design: Print design

Rozměrová normalizace polovodičových součástek - Část 2: Rozměry - Dvaadvacátý doplněk. (Norma přebírající anglický originál, vlastní text je součástí výtisku).

Available languages: English (the title page in Czech only)

Available design: Print design

Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-third supplement

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 2: Dimensions - Twenty-fourth supplement

Available languages: Czech preface only

Available design: Print design