ČSN - Czech national standards

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices

Available design: Print design

Available design: Print design

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

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Available design: Print design

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

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Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

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Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - First supplement

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Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement

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