ČSN - Czech national standards

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Available languages: English

Available design: Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Available languages: English (the title page in Czech only)

Available design: Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Available languages: English

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Available languages: English

Available design: Print design

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assembliess

Available languages: Czech

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Available languages: Czech

Available design: Print design

Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury. (Platnost do 1.9.2009).

Available design: Print design

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Available design: Print design

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Available languages: English

Available design: Print design

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Available languages: Czech

Available design: Print design