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Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Available languages: Czech
Available design: Print design
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Available languages: Czech
Available design: Print design
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Available languages: Czech
Available design: Print design
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Available languages: English (the title page in Czech only)
Available design: Print design
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Available design: Print design
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Available design: Print design
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Available design: Print design
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Available design: Print design
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Available design: Print design
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Available design: Print design