ČSN - České národní normy

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assembliess

Dostupné jazyky: Česky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

Dostupné jazyky: Česky

Dostupné prevedenie: Tlačené

Zkušební metody pro elektrotechnické materiály, propojovací struktury a sestavy - Část 2: Zkušební metody pro materiály pro propojovací struktury. (Platnost do 1.9.2009).

Dostupné prevedenie: Tlačené

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Dostupné prevedenie: Tlačené

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Dostupné jazyky: Česky

Dostupné prevedenie: Tlačené