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Workmanship requirements for soldered electronic assemblies - Part 1: General
Available design: Print design
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Available design: Print design
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS
Available design: Print design
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Available design: Print design
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Available design: Print design
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Available languages: Czech
Available design: Print design
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Available languages: Czech
Available design: Print design
Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing
Available languages: English (the title page in Czech only)
Available design: Print design
Base materials for printed circuits. Part 1: Test methods (includes Amendment A4:1994)
Available design: Print design
Base materials for printed circuits - Part 2: Specifications - Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality
Available design: Print design