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Stránka 3407
Workmanship requirements for soldered electronic assemblies - Part 1: General
Dostupné prevedenie: Tlačené
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Dostupné prevedenie: Tlačené
Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assembliesS
Dostupné prevedenie: Tlačené
Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
Dostupné prevedenie: Tlačené
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
Dostupné prevedenie: Tlačené
Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
Dostupné jazyky: Česky
Dostupné prevedenie: Tlačené
Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
Dostupné jazyky: Česky
Dostupné prevedenie: Tlačené
Quality assessment systems - Part 3: Selection and use of sampling plans for printed boards and laminate end-products and in-process auditing
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Base materials for printed circuits. Part 1: Test methods (includes Amendment A4:1994)
Dostupné prevedenie: Tlačené
Base materials for printed circuits - Part 2: Specifications - Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality
Dostupné prevedenie: Tlačené