Potřebujeme Váš souhlas k využití jednotlivých dat, aby se Vám mimo jiné mohli ukazovat informace týkající se Vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Page 3534
Product package labels for electronic components using bar code and two-dimensional symbologies
Available design: Print design
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
Available languages: English (the title page in Czech only)
Available design: Print design
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
Available languages: English (the title page in Czech only)
Available design: Print design
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
Available languages: English (the title page in Czech only)
Available design: Print design
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 4: Cyclic bending test
Available languages: English (the title page in Czech only)
Available design: Print design
Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1- 5: Mechanical shear fatigue test
Available languages: English (the title page in Czech only)
Available design: Print design
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Available languages: English (the title page in Czech only)
Available design: Print design
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Available languages: Czech
Available design: Print design
Environmental and endurance testing -Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
Available design: Print design
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Available languages: Czech
Available design: Print design