IEC - International electro-technical commission

Device embedded substrate - Part 1-1: Generic specification - Test methods
(Substrat avec appareil(s) integre(s) - Partie 1-1: Specification generique - Methodes d´essai)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
(Techniques d’assemblage avec appareils integres - Partie 1: Specification generique pour substrats avec appareils integres)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedded substrate - Part 2-1: Guidelines - General description of technology
(Substrat avec appareil(s) integre(s) - Partie 2-1: Directives - Description generale de la technologie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedding assembly technology - Part 2-10: Design specification for cavity substrate

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
(Substrat avec appareil(s) integre(s) - Partie 2-2: Directives - Essai electrique)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedded substrate - Part 2-3: Guidelines - Design guide
(Substrat avec appareil(s) integre(s) - Partie 2-3: Directives - Guide de conception)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
(Substrat avec appareil(s) integre(s) - Partie 2-4: Directives - Groupes d´elements d´essai (TEG))

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
(Technologie d’ensemble avec appareil(s) integre(s) - Partie 2-5 : Lignes directrices - Mise en ouvre d’un format de donnees 3D pour un substrat avec appareil(s) integre(s))

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-602: Lignes directrices pour un empilement de modules electroniques - Methode d’evaluation de la connectivite electrique entre modules)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
(Techniques d’assemblage avec appareil(s) integre(s) - Partie 2-603: Lignes directrices pour un empilement de modules electroniques - Methode d’essai de la connectivite electrique entre modules)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM