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STN - Slovak standards
Page 2438
STN EN 61189-5-1 (01/03/2017)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
Available languages: English
Available design: Print design
STN EN 61189-5-2 (01/08/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Available languages: English
Available design: Print design
STN EN 61189-5-3 (01/08/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Available languages: English
Available design: Print design
STN EN 61189-5-4 (01/08/2015)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Available languages: English
Available design: Print design
STN EN IEC 61189-5-301 (01/08/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
Available languages: English
Available design: Print design
STN EN IEC 61189-5-501 (01/07/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes
Available languages: English
Available design: Print design
STN EN IEC 61189-5-502 (01/07/2021)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies
Available languages: English
Available design: Print design
STN EN 61189-5-503 (01/02/2018)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards
Available languages: English
Available design: Print design
STN EN IEC 61189-5-504 (01/10/2020)
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
Available languages: English
Available design: Print design
STN EN IEC 61189-5-601 (01/07/2021)
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Available languages: English
Available design: Print design
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