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Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.0W/m K and defined flammability (vertical burning test), copper-clad for lead-free assembly
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.5W/m K and defined flammability (vertical burning test), copper-clad for lead-free assembly
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0W/m K and defined flammability (vertical burning test), copper-clad for lead-free assembly
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures. Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyester film (IEC 61249-3-3:1999)
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures. Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyimide film (IEC 61249-3-4:1999)
Available languages: English
Available design: Print design
Materials for printed boards and other interconnecting structures. Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Transfer adhesive films (IEC 61249-3-5:1999)
Available languages: English
Available design: Print design
Materials for circuit boards and other interconnecting structures - Part 3-6: Sectional specification set for unreinforced base materials clad and unclad - Polytetrafluoroethylene (PTFE) filled laminate sheets of defined flammability (vertical burning test), copper-clad
Available languages: English
Available design: Print design