STN - Slovak standards

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Available languages: English

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

Available languages: English

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Available languages: English

Available design: Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Available languages: English

Available design: Print design

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Available languages: English

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Available languages: English

Available design: Print design

Vulcanized fibre for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: Flat sheets

Available languages: English

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Available languages: English

Available design: Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Available languages: English

Available design: Print design

Test methods for electrical materials, interconnection structures and assemblies Part 5: Test methods for printed board assemblies

Available languages: English

Available design: Print design