STN - Slovenské národní normy

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené