STN - Slovak standards

Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Available languages: English

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Analogue integrated circuits. Measuring methods of electrical parameters

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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

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Mechanical standardization of semiconductor devices. Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

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Mechanical standardization of semiconductor devices Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

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Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

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Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Available languages: English

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Semiconductor devices - Micro-electromechanical devices Part 2: Tensile testing method of thin film materials

Available languages: English

Available design: Print design

Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing

Available languages: English

Available design: Print design