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STN - Slovak standards
Page 2987
STN EN 62047-14 (01/08/2012)
Polovodičové súčiastky. Elektromechanické mikrosúčiastky. Časť 14: Meracia metóda medze pretvorenia materiálov s kovovou vrstvou (Norma na priame používanie ako STN).
Available languages: English
Available design: Print design
STN EN 62047-16 (01/12/2015)
Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films ÔÇô Wafer curvature and cantilever beam deflection methods
Available languages: English
Available design: Print design
STN EN 62047-17 (01/12/2015)
Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
Available languages: English
Available design: Print design
STN EN 62047-18 (01/02/2014)
Polovodičové súčiastky. Elektromechanické mikrosúčiastky. Časť 18: Skúšobné metódy ohybom tenkovrstvových materiálov (Norma na priame používanie ako STN).
Available languages: English
Available design: Print design
STN EN 62047-19 (01/02/2014)
Polovodičové súčiastky. Elektromechanické mikrosúčiastky. Časť 19: Elektronické kompasy (Norma na priame používanie ako STN).
Available languages: English
Available design: Print design
STN EN 62047-20 (01/02/2015)
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
Available languages: English
Available design: Print design
STN EN 62047-21 (01/02/2015)
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson´s ratio of thin film MEMS materials
Available languages: English
Available design: Print design
STN EN 62047-22 (01/02/2015)
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
Available languages: English
Available design: Print design
STN EN 62047-25 (01/04/2017)
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
Available languages: English
Available design: Print design
STN EN 62047-26 (01/10/2016)
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures
Available languages: English
Available design: Print design
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