UNE - Spanish national standards

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (Endorsed by Asociación Espanola de Normalización in November of 2018.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz) (Endorsed by AENOR in November of 2016.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (Endorsed by Asociación Espanola de Normalización in June of 2024.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator (Endorsed by AENOR in August of 2015.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials (Endorsed by Asociación Espanola de Normalización in October of 2023.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards (Endorsed by Asociación Espanola de Normalización in October of 2023.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (Endorsed by Asociación Espanola de Normalización in November of 2023.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA (Endorsed by Asociación Espanola de Normalización in July of 2024.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T_d) using TGA (Endorsed by Asociación Espanola de Normalización in November of 2021.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method (Endorsed by Asociación Espanola de Normalización in July of 2024.)

Available languages: English

Available design: electronic design (pdf), Print design