UNE - Spanish national standards

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA (Endorsed by Asociación Espanola de Normalización in March of 2025.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 2: Test methods for materials for interconnection structures (IEC 61189-2:2006). (Endorsed by AENOR in January of 2007.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT) (Endorsed by Asociación Espanola de Normalización in January of 2026.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (Endorsed by AENOR in May of 2016.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards) (Endorsed by AENOR in May of 2008.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies (Endorsed by AENOR in November of 2016.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (Endorsed by AENOR in April of 2015.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (Endorsed by AENOR in April of 2015.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Espanola de Normalización in June of 2021.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (Endorsed by AENOR in April of 2015.)

Available languages: English

Available design: electronic design (pdf), Print design