UNE - Spanish national standards

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes (Endorsed by Asociación Espanola de Normalización in April of 2021.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (Endorsed by Asociación Espanola de Normalización in April of 2021.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards (Endorsed by Asociación Espanola de Normalización in September of 2017.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT) (Endorsed by Asociación Espanola de Normalización in July of 2020.)

Available languages: English

Available design: electronic design (pdf), Print design

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Espanola de Normalización in April of 2021.)

Available languages: English

Available design: electronic design (pdf), Print design

Attachment materials for electronic assembly -- Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (Endorsed by AENOR in November of 2002.)

Available languages: English

Available design: electronic design (pdf), Print design

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (Endorsed by AENOR in July of 2014.)

Available languages: English

Available design: electronic design (pdf), Print design

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Espanola de Normalización in April of 2018.)

Available languages: English

Available design: electronic design (pdf), Print design

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (Endorsed by Asociación Espanola de Normalización in December of 2018.)

Available languages: English

Available design: electronic design (pdf), Print design

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (Endorsed by Asociación Espanola de Normalización in November of 2017.)

Available languages: English

Available design: electronic design (pdf), Print design