Withdrawn | Published: 01/01/1989

ASTM F1259-89 Withdrawn

Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure Due to Electromigration

Available languages: English

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Detail information

Designation: ASTM F1259-89

Publication date: 01/01/1989

Pages: 2

Note: Withdrawn

Country: American technical standard

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Keywords:
Accelerated aging/testing-semiconductors, Defects-semiconductors, Electrical conductors-semiconductors, Electromigration, Failure end point-electronic components/devices, Metallization, Microelectronic device processing, Resistance-failure, Silicon-semiconductor applications, Straight-line testing, Test structures, Time to failure, Voltage, design of flat straight-line test structures (for detecting, metallization open-circuit/resistance to increase failure due to, electromigration), guide

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