Cookies
Potřebujeme Váš souhlas k využití jednotlivých dat, aby se Vám mimo jiné mohli ukazovat informace týkající se Vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Active standard | Published: 27/02/2020
BS EN IEC 61190-1-3:2018-TC
Tracked Changes. Attachment materials for electronic assembly. Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications.
Available languages: English
Available design: electronic design (pdf), Print design
from 498.10 EUR
show on eshop
Detail information
Designation: BS EN IEC 61190-1-3:2018-TC
Publication date: 27/02/2020
Pages: 111
Country: British technical standard
Where to buy?
You can buy at www.mystandards.bizAnotation
ISBN: 978 0 539 11142 2 Status: DefinitivePopular Publishers
DIN standards
BS standards
ASTM standards
ISO standards
IEC standards
Copyright © All rights reserved | This template is made with by Colorlib
