Cookies
Potřebujeme Váš souhlas k využití jednotlivých dat, aby se Vám mimo jiné mohli ukazovat informace týkající se Vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Active standard | Published: 01/03/2022
ČSN EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
Available languages: English
Available design: Print design
from 10.70 USD
show on eshop
Detail information
Designation: ČSN EN IEC 61189-2-807
Publication date: 01/03/2022
Pages: 20
Country: Czech technical standard
Where to buy?
You can buy at www.mystandards.bizAnotation
This part of IEC 61189 specifies a test method to determine the decomposition temperature (Td) of base laminate materials using thermogravimetric analysis (TGA)Popular Publishers
DIN standards
BS standards
ASTM standards
ISO standards
IEC standards
Copyright © All rights reserved | This template is made with by Colorlib
