Active standard | Published: 01/01/2003

DIN EN 61190-1-1:2003-01

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly.
(Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage.)

Available languages: German

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Detail information

Designation: DIN EN 61190-1-1:2003-01

Publication date: 01/01/2003

Pages: 22

Country: German technical standard

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Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-1: Anforderungen an Weichlöt-Flussmittel für hochwertige Verbindungen in der Elektronikmontage.

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