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Active standard | Published: 01/11/2014
DIN EN 61190-1-2:2014-11
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly.
(Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.)
Available languages: German
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Detail information
Designation: DIN EN 61190-1-2:2014-11
Publication date: 01/11/2014
Pages: 24
Country: German technical standard
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Verbindungsmaterialien für Baugruppen der Elektronik - Teil 1-2: Anforderungen an Lotpaste für hochwertige Verbindungen in der Elektronikmontage.Popular Publishers
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