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Active standard | Published: 23/05/2023
GB/T 15879.604-2023
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)
Available languages: English, Chinese
Available design: electronic design (pdf), Print design
from 374.60 EUR
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Detail information
Designation: GB/T 15879.604-2023
Publication date: 23/05/2023
Pages: 0
Country: Chinese technical standard
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