Active standard | Published: 11/06/2003

IEC 60191-6-4-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-4: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Methodes de mesure pour les dimensions des boitiers matriciels a billes (BGA))

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Detail information

Designation: IEC 60191-6-4-ed.1.0

Publication date: 11/06/2003

Pages: 32

Country: International technical standard

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Anotation

IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions. La CEI 60191-6-4:2003 couvre les exigences relatives aux methodes de mesure des dimensions des boitiers matriciels a billes (BGA).

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