Active standard | Published: 27/08/2001

IEC 60191-6-5-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Available languages: English, Spanish

Available design: electronic design (pdf), Print design, CD-ROM

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Detail information

Designation: IEC 60191-6-5-ed.1.0

Publication date: 27/08/2001

Pages: 10

Country: International technical standard

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Anotation

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.

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