Active standard | Published: 27/08/2001

IEC 60191-6-8-ed.1.0

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
(Normalisation mecanique des dispositifs a semiconducteurs - Partie 6-8: Regles generales pour la preparation des dessins d´encombrement des dispositifs a semiconducteurs a montage en surface - Guide de conception pour les boitiers plats quadrangulaires en ceramique, scellement verre (G-QFP))

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Detail information

Designation: IEC 60191-6-8-ed.1.0

Publication date: 27/08/2001

Pages: 22

Country: International technical standard

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Anotation

IEC 60191-6-8:2001 provides the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack (hereinafter called G-QFP). The object of this design guide is to standardize outlines and obtain interchangeability of G-QFP. La CEI 60191-6-8:2001 fournit les dessins dencombrement et les dimensions courants de tous les types de structures et de materiaux composes de boitiers plats quadrangulaires en ceramique, scellement verre (appeles ci-apres G-QFP). Lobjectif du present guide de conception est de normaliser les encombrements et dobtenir linterchangeabilite des G-QFP.

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