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Active standard | Published: 28/07/2010
IEC 60749-19-ed.1.0/Amd.1 Change
Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
(Amendement 1 - Dispositifs a semiconducteurs - Methodes d´essais mecaniques et climatiques - Partie 19: Resistance de la pastille au cisaillement)
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Detail information
Designation: IEC 60749-19-ed.1.0/Amd.1
Publication date: 28/07/2010
Pages: 4
Note: Change
Country: International technical standard
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