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Active standard | Published: 22/10/2024
IEC 63378-2-1-ed.1.0
Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
Available languages: English
Available design: electronic design (pdf), Print design, CD-ROM
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Detail information
Designation: IEC 63378-2-1-ed.1.0
Publication date: 22/10/2024
Pages: 0
Country: International technical standard
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IEC 63378-2-1:2024 specifies three-dimensional (3D) thermal models of discrete semiconductor packages (TO-243, TO-252 and TO-263), utilized in the steady-state thermal analysis of electronic devices to estimate junction temperatures accurately. This model is assumed to be made by semiconductor suppliers and to be used by assembly makers of electronic devices.Popular Publishers
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