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Active standard | Published: 22/03/2016
JIS C62137-4:2016
Electronics assembly technology -- Part 4: Endurance test methods for solder joint of area array type package surface mount devices
Available languages: Japanese
Available design: electronic design (pdf), Print design
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Detail information
Designation: JIS C62137-4:2016
Publication date: 22/03/2016
Pages: 42
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