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Withdrawn | Published: 01/01/2004
STN EN 60749-20 Withdrawn
Semiconductor devices - Mechanical and climatic test methods -- Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat
Available design: Print design
Detail information
Designation: STN EN 60749-20
Publication date: 01/01/2004
Pages: 27
Note: Withdrawn
Country: Slovak technical standard
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