ČSN - České národní normy

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Dostupné jazyky: Len český predhovor

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Dostupné jazyky: Len český predhovor

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)

Dostupné prevedenie: Tlačené

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené