ČSN - České národní normy

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Dostupné jazyky: Česky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Dostupné jazyky: Česky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5 -1: General test methods for materials and assemblies - Guidance for printed board assemblies

Dostupné jazyky: Česky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené