ČSN - České národní normy

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené