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Stránka 3406
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Dostupné jazyky: Česky
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Dostupné jazyky: Česky
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Dostupné jazyky: Česky
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Dostupné jazyky: Anglicky (v českom jazyku len titulná strana)
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
Dostupné prevedenie: Tlačené
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
Dostupné prevedenie: Tlačené