STN - Slovenské národní normy

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 3: Test methods for interconnection structures (printed boards)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Vulcanized fibre for electrical purposes - Part 3: Specifications for individual materials - Sheet 1: Flat sheets

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené

Test methods for electrical materials, interconnection structures and assemblies Part 5: Test methods for printed board assemblies

Dostupné jazyky: Anglicky

Dostupné prevedenie: Tlačené