GB - Chinese national standards

Directives for drafting semiconductor facilities interface specification

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

General specification for trunked mobile communication system

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

General specification for leaky cable radiocommunication system

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Semiconductor integrated circuits—Specification of leadframes for plastic quad flat package

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Semiconductor integrated circuits—Specification of DIP leadframes produced by etching

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Semiconductor integrated circuits—Specification of leadframes for small outline package

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Available languages: English, Chinese

Available design: electronic design (pdf), Print design

Mechanical standardization of semiconductor devices—Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Design guidelines for fine-pitch land grid array (FLGA)

Available languages: English, Chinese

Available design: electronic design (pdf), Print design