ČSN - Czech national standards

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Available languages: English (the title page in Czech only)

Available design: Print design

Rozměrová normalizace polovodičových součástek - Část 4: Kódovací systém a roztřídění podle tvarů pro pouzdra polovodičových součástek. (Norma přebírající anglický originál, vlastní text je součástí výtisku).

Available languages: English (the title page in Czech only)

Available design: Print design

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Available languages: English (the title page in Czech only)

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Available languages: Czech preface only

Available design: Print design

Rozměrová normalizace polovodičových součástek - Část 6-2: Všeobecná pravidla pro přípravu výkresů pouzder polovodičových součástek pro povrchovou montáž - Konstrukční návod pro pouzdra s vývody ve tvaru kuliček s roztečí 1,50 mm, 1,27 mm a 1,00 mm uspořádaných do sloupců. (Text normy není součástí výtisku).

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Available languages: Czech preface only

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Available languages: English (the title page in Czech only)

Available design: Print design

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Available languages: Czech preface only

Available design: Print design