Potřebujeme Váš souhlas k využití jednotlivých dat, aby se Vám mimo jiné mohli ukazovat informace týkající se Vašich zájmů. Souhlas udělíte kliknutím na tlačítko „OK“.
Page 390
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits
(Dispositifs a semiconducteurs. Circuits integres - Deuxieme partie: Circuits integres numeriques - Section six: Specification particuliere cadre pour les microprocesseurs a circuits integres)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories
(Dispositifs a semiconducteurs. Circuits integres - Deuxieme partie: Circuits integres numeriques - Section sept: Specification particuliere cadre pour les memoires bipolaires a lecture seule programmables par fusion a circuits integres)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories
(Dispositifs a semiconducteurs - Circuits integres - Partie 2: Circuits integres numeriques - Section Huit: Specification particuliere cadre pour les memoires a circuits integres a lecture-ecriture a fonctionnement statique)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
(Dispositifs a semiconducteurs - Circuits integres - Partie 2: Circuits integres numeriques - Section 9: Specification particuliere cadre pour les memoires mortes MOS effacables aux UV et programmables electriquement)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
(Dispositifs a semiconducteurs - Circuits integres - Partie 2: Circuits integres numeriques)
Available languages: English and French
Available design: electronic design (pdf), CD-ROM
Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination
(Dispositifs a semiconducteurs - Circuits integres - Partie 20: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches - Section 1: Exigences pour l´examen visuel interne)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits
(Amendement 1 - Dispositifs a semiconducteurs. Circuits integres. Vingtieme partie: Specification generique pour les circuits integres a couches et les circuits integres hybrides a couches)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21-1:Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM
Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 21:Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´homologation)
Available languages: English and French
Available design: electronic design (pdf), Print design, CD-ROM