IEC - International electro-technical commission

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22-1: Specification particuliere cadre pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
(Dispositifs a semiconducteurs - Circuits integres - Partie 22: Specification intermediaire pour les circuits integres a couches et les circuits integres hybrides a couches sur la base des procedures d´agrement de savoir-faire)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers´ self-audit checklist and report

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers
(Dispositifs a semiconducteurs. Circuits integres - Troisieme partie: Circuits integres analogiques - Section un: Specification particuliere cadre pour les amplificateurs operationnels integres monolithiques)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits
(Dispositifs a semiconducteurs - Circuits integres - Partie 3: Circuits integres analogiques)

Available languages: Russian, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Amendment 1 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits
(Amendement 1 - Dispositifs a semiconducteurs. Circuits integres. Troisieme partie: Circuits integres analogiques)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM