IEC - International electro-technical commission

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-3: Conception de la zone de report - Description de la zone de report pour les composants a trous traversants (THT))

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 6-4: Conception de la zone de report - Exigences generiques pour les dessins dimensionnels de composants montes en surface (CMS) du point de vue de la conception de la zone de report)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
(Cartes imprimees et cartes imprimees equipees - Conception et utilisation - Partie 7: Orientation nulle des composants electroniques pour l´elaboration d’une bibliotheque CAO)

Available languages: English, English and French

Available design: electronic design (pdf), Print design, CD-ROM

Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
(Methodes d´essais pour les materiaux electriques, les structures d´interconnexion et les ensembles - Partie 1: Methodes d´essai generales et methodologie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
(Amendement 1 - Methodes d´essais pour les materiaux electriques, les structures d´interconnexion et les ensembles - Partie 1: Methodes d´essai generales et methodologie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
(Methodes d´essai pour les materiaux electriques, les structures d´interconnexion et les ensembles - Partie 1: Methodes d´essai generales et methodologie)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 11: Mesure de la temperature de fusion ou des plages de temperatures de fusion des alliages a braser)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
(Methodes d’essai pour les materiaux electriques, les cartes imprimees et autres structures d’interconnexion et ensembles - Partie 2-501: Methodes d’essai des materiaux pour structures d’interconnexion - Mesure de la puissance elastique et du facteur de retention de la puissance elastique des materiaux dielectriques flexibles)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
(Methodes d´essai pour les materiaux electriques, les cartes imprimees et autres structures d´interconnexion et ensembles - Partie 2-630: Methodes d´essai des materiaux pour structures d´interconnexion - Absorption d´humidite apres conditionnement dans un recipient sous pression)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM