IEC - International electro-technical commission

Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level
(Noyaux en materiaux magnetiques doux - Methodes de mesure - Partie 3: Proprietes magnetiques a niveau eleve d´excitation)

Available languages: English and French

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Cores made of soft magnetic materials - Measuring methods - Part 3: Magnetic properties at high excitation level

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Multimedia security - Guideline for privacy protection of equipment and systems in and out of use - Part 1: General

Available languages: English

Available design: electronic design (pdf), Print design, CD-ROM

Safety of machinery - Application of protective equipment to detect the presence of persons
(Securite des machines - Application des equipements de protection a la detection de la presence de personnes)

Available languages: English, French, English and French

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Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 1: Termes et definitions)

Available languages: English and French

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Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Dispositifs a semiconducteur - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)

Available languages: English and French

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Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
(Corrigendum 1 - Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 10: Essai de compression utilisant la technique des micro-piliers pour les materiaux des MEMS)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 11: Methode d´essai pour les coefficients de dilatation thermique lineaire des materiaux autonomes pour systemes microelectromecaniques)

Available languages: English and French

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Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 12: Methode d´essai de fatigue en flexion des materiaux en couche mince utilisant les vibrations a la resonance des structures a systemes microelectromecaniques (MEMS))

Available languages: English and French

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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
(Dispositifs a semiconducteurs - Dispositifs microelectromecaniques - Partie 13: Methodes d´essais de types courbure et cisaillement de mesure de la resistance d´adherence pour les structures MEMS)

Available languages: English and French

Available design: electronic design (pdf), Print design, CD-ROM