JIS - Japanese technical standards

Measuring method of optical modulator modules

Available languages: Japanese

Available design: electronic design (pdf), Print design

General rules of pin-FET modules

Available languages: Japanese

Available design: electronic design (pdf), Print design

Measuring methods of pin-FET modules

Available languages: Japanese

Available design: electronic design (pdf), Print design

Printed boards and printed board assemblies -- Design and use -- Part 7: Electronic component zero orientation for CAD library construction

Available languages: Japanese

Available design: electronic design (pdf), Print design

Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Available languages: Japanese

Available design: electronic design (pdf), Print design

Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies

Available languages: Japanese

Available design: electronic design (pdf), Print design

Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies

Available languages: Japanese

Available design: electronic design (pdf), Print design

Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies

Available languages: Japanese

Available design: electronic design (pdf), Print design

Printed board assemblies -- Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Available languages: Japanese

Available design: electronic design (pdf), Print design

Optical amplifers -- Part 1: Generic specification

Available languages: Japanese

Available design: electronic design (pdf), Print design