Withdrawn | Published: 01/11/2012

ASTM D5109-12 Withdrawn

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

Available languages: English

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Detail information

Designation: ASTM D5109-12

Publication date: 01/11/2012

Pages: 9

Note: Withdrawn

Country: American technical standard

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Keywords:
copper-clad laminate, dielectric breakdown parallel to laminations, dimensional instability, dissipation factor, fiber reinforced, flexural strength, industrial laminate, laminate, oven blister, peel strength, permittivity, printed circuit boards, printed wiring boards, rigid laminate, solder float, surface resistivity, thermoset, thickness variation, trace, twist, volume resistivity, warp, water absorption, ICS Number Code 31.180 (Printed circuits and boards), 83.140.20 (Laminated sheets)

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